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Site:HOME > PRODUCT
  • Product Name:Lamination cushion pad FCP series
  • Category:Lamination plate and pads > Lamination pads
  • Product Type:FCP series
  • Point Hits:975
  • Lamination cushion pad FCP series

      

    Lamination cushion pad is specially designed for plastic card lamination use. It is being widely used in the production of a variety of Inlay sheets, bank cards, credit cards and other smart card. 

    The key features are summarized as follows: 

    Ø The product raw materials are imported from Germany to ensure high temperature resistance and excellent elastic resilience.  

     

    Ø It is fast in heat transfer with even heat distribution, which can greatly improve the yield of cards in the process of card lamination.  

    Ø It has excellent pressure resistance without distortion.  It has great reliability and durability. 

    Ø It can help eliminate surface pits and fine grains on the laminated card surface.  

    Ø It features solvent resistance, aging resistance, and corrosion resistance. It is non-toxic and odorless and can meet environmental requirements. 

    Ø It has good cushioning performance to avoid scratches by hard contact between heating plate and laminating steel plate. It can extend the life of laminator heating plate and laminating steel plate. 
    Note: The size can be cut according to user requirements.
     

           

    Model

    FCP-1

    FCP-2

    FCP-3

    Surface material

    Silicon rubber with patterns

    Heat-proof felt

    Copper wire plus silicon rubber

    Middle material

    Glass fiber

    Silicon rubber

    Copper wire 

    Thickness

    3.5mm

    3.5mm

    22.5mm

    Thickness tolerance

    ±0.2mm

    ±0.2mm

    ±0.2mm

    Elastic resilience

    Excellent

    Good

    Good

    Color

    White

    White

    Brown

    Hardness

    55±5

    50±5

    65

    Layer adhesion strength

    ≥ 10 N/cm

    ≥ 10 N/cm

    Application temperature

    ≤230

    ≤200

    ≤260

    Pressure level

    10 MPa

    10MPa

     15-35MPa

    Storage temperature

    0-50

    0-50

    0-50

    Storage humidity

    40%RH

    40%RH

    40%RH

    Application scope

    Inlay sheet, normal card, SIM card, bank cards, etc.

    Inlay sheet, normal card, SIM card, bank cards, etc.

    Inlay sheet, ID card, bank cards, etc.


    Copyrights: Tianjin DEKON New Materials Technology Ltd. All Right Reserved.
    Tel: 0086-22-88987508 Website: www.fdyk.net